DIC – Digital Image Correlation

Digital Image Correlation (DIC) is a 3D, full-field, non-contact optical technique to measure contour, deformation, vibration and strain on almost any material. The technique can be used for many tests including tensile, torsion, bending and combined loading for both static and dynamics applications. The method can be applied from very small (micro) to large testing areas – and the results are readily comparable with FEA results or strain gauges.

Features

• 3D Full-field, Real-time display of displacement and strain overlaid on live image
• Real-Time Correlation with analog voltage output – evaluate, display and output data in real-time for interfacing with other equipment
• Multi-camera system for up to 360 degree measurement around an object and simultaneous front and back side measurements (thinning)
• Measurement area <1mm up="" to= several square meters"">1m
• Fast and easy automatic calibration procedure
• Online feedback of accuracy and quality
• All data with a confidence margin (error approximation)
• Full access to data using an open data format
• Synchronous recording of analog data
• Extended export and import - to FEA software for comparisons
• Different coordinate systems
• High speed cameras up to 1,000,000 frames/sec

Contour, Deformation and Strain Measurement

Q-400 - DIC Standard 3D 

For 3D shape, displacement and strain measurement

Q-480 - DIC Handheld 

For 'point & shoot' displacement and strain measurement

Q-400 - µDIC

For microscopic thermal expansion and warpage measurement

Q-400 DIC TCT

For thermal expansion, strain and warpage measurement

Vibration Measurement

Q-450 - DIC High-Speed 

For vibration measurement

Videoextensometer - Real Time Strain Sensor

Videoextensometer RTSS

Learn more about DIC